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AmDynamic Bond
Kuala Lumpur, Malaysia
AmDynamic Bond, Kuala Lumpur, Malaysia · LEI: 2549005WBI113BDM5R83 · Bentuk Perusahaan: 8888 · Status: LAPSED. Free company profile — no paywall, no login
FAQ — AmDynamic Bond
- What is the LEI of AmDynamic Bond?
- Pengenal Badan Hukum (LEI) AmDynamic Bond adalah 2549005WBI113BDM5R83.
- Where is AmDynamic Bond registered?
- AmDynamic Bond memiliki alamat terdaftar di Kuala Lumpur, Malaysia.
- Is the register extract of AmDynamic Bond free of charge?
- Ya. Eulerpool menyediakan semua data pendaftaran perusahaan — termasuk catatan lengkap AmDynamic Bond — sepenuhnya gratis, tanpa perlu login.
Official registry record
The complete official register extract — every field from the LEI / company register, free of charge, no login required.
| legal_name | AmDynamic Bond |
|---|---|
| legal_city | Kuala Lumpur |
| legal_jurisdiction | MY |
| lei | 2549005WBI113BDM5R83 |
| entity_category | FUND |
| entity_legal_form_code | 8888 |
| legal_first_address_line | 9th Flr Banagunan AmBankGroup |
| legal_additional_address_line | 55 Jalan Raja Chulan |
| legal_postal_code | 50200 |
| headquarters_first_address_line | c/o AmFunds Management Berhad |
| headquarters_additional_address_line | 9th Flr Banagunan AmBankGroup |
| headquarters_city | Kuala Lumpur |
| headquarters_postal_code | 50200 |
| next_renewal_date | 21/8/2023 |
| last_update_date | 21/8/2023 |
| managing_lou | 5493001KJTIIGC8Y1R12 |
| registration_status | LAPSED |
| validation_sources | ENTITY_SUPPLIED_ONLY |